High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components

Product Details
Morphology: Solid-State
Application: Electronic Product
Material: Polyurethane
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Registered Capital
3000000 RMB
Plant Area
33300 square meters
  • High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
  • High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
  • High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
  • High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
  • High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
  • High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
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Basic Info.

Model NO.
EG-1012.43
Classification
Hot Melt
Color
White
Transport Package
Pail
Specification
30ml
Trademark
EG
Origin
China
HS Code
35069190
Production Capacity
2000ton/Year

Product Description

EG-1012 is polyurethane based hot melt adhesive which can be used in electronic and microelectronic industries.



Product Description

Wuxi East Group has many kinds of electronic adhesive.
EG-1012 is reactive hot melt adhesive. It shoude be heated and melted into fluid under the condition of inhibiting chemical reaction, so as to facilitate coating.


High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
Product Name High Temprature Resistant Hot Melt PUR Adhesive for Electronic and Microelectronic Components
Brand Wuxi East Group
Appearance Yellowish solid
Color Yellowish
Base Material Polyurethane
Glue Type Hot melt adhesive
Packing 30ml/tube
Storage Temperature 23~25ºC
Storage Time 12 Months



Application

High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
Applied Products Electronic, Microelectronic
Service Temperature Around 110ºC
Viscosity 5000 ~ 5300 CPS @ 110 ºC
Opening time 20ºC, 90-120s


 
Features

Good adhesiveness and strong bonding for glass and metal
The performances of this single component are neutral curing, no corrosion and easy operation which meet the requirement of RoHS.
Superior performances of weather aging resistance, UV resistance, ozone resistance, moisture-proof and waterproof
High and low temperature and little changes



Features

High strength
Wide temprature adaptability
Risistance to humidity, heat and chemical


 
Our Company

High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components
East Group at a Glance

Hot melting adhesive is a kind of most efficient and environmental protection method for our global growth market. The East Group as a medium-sized adhesive manufacturers in China has started its business since 1997. Tradition and experience from over 24 years we already be one of the biggest hot melting adhesive suppliers in China.

Our annually production over than 50, 000 tons includes most part of hot melting adhesives which are EVA, PSA, PUR meanwhile we are professional in vacuum glue in wooden industry area.

Ranking as leader of adhesive innovation in China make us well known numerous markets and applications. National level laboratory and experts provide best one stop solution for all of our customers.



 
Quality Control

High Temperature Resistant PUR Hot Melt Adhesive for Electronic and Microelectronic Components


 
 
 

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